Ceramic PCB| Ceramic Circuit Board| Ceramic PCB Substrate-Best Technology Ceramic PCB

Ceramic PCB

Ceramic subtrates are a thin, flat fired-ceramic material that has outstanding thermal and dielectric properties. Typical substrates are generally made out of aluminum oxide or bryllium oxide.

Ceramic PCB has the characteristics of higher operating temperature, lower expansion coefficient,good thermal properties,superior high-frequency performance and the ability to prevent the absorption of water.

Ceramic PCB Capabilities
Ceramic PCB Material
Prototype Lead Time
Mass Production Lead Time

Item	Thick Film Capabilities	DCB/DBC Capabilities	DPC Capabilities	AMB Capabilities
Layer Count	10 Layers	2 Layers	2 Layers	2 Layers
Max Board Dimension	138*190mm	138*178mm	138*190mm	114*114mm
Min Board Thickness	0.25mm	0.30mm - 0.40mm	0.25mm	0.25mm
Max Board Thickness	2.0mm	1L: 1.3mm; 2L 1.6mm	2.0mm	1.8mm
Conductor Thickness	5um - 13um	0.10mm - 0.30mm	2um - 200um	0.25mm - 0.80mm
Min Line Width/Line Space	6/8mil (0.15/0.20mm)	12/12mil (0.30/0.30mm)	6/8mil (0.15/0.20mm)	20/20mil (0.50/0.50mm)
Substrate Type	Al2O3, AIN, BeO, ZrO2	Al2O3, AIN, ZrO2	Al2O3, AIN, ZrO2, Si3N4	Al2O3, AIN, Si3N4
Substrate Thickness	0.25, 0.38, 0.50, 0.635, 0.80, 1.0, 1.5, 2.0mm	0.25, 0.38, 0.50, 0.635, 0.76, 1.0, 1.5, 2.0mm	0.25, 0.38, 0.50, 0.635, 0.80, 1.0, 1.5, 2.0mm	0.25, 0.38, 0.50, 0.635, 0.76, 1.0mm
Min Hole Diameter	4mil (0.1mm)
Min Hole Spacing	NPTH: 16mil (0.30mm); PTH: 20mil (0.5mm)
Min PAD Ring(Single)	6mil (0.15mm)	N/A	3mil (0.075mm)	N/A
PTH Wall Thickness	4mil (10um)	N/A	4mil (10um)	N/A
Min Solder PAD Dia	10mil (0.25mm)	8mil (0.20mm)	6mil (0.15mm)	8mil (0.20mm)
Min Soldermask Bridge	12mil (0.30mm)	8mil (0.20mm)	6mil (0.15mm)	8mil (0.20mm)
Min BGA PAD Margin	12mil (0.30mm)	8mil (0.20mm)	5mil (0.125mm)	8mil (0.20mm)
PTH/NPTH Dia Tolerance	PTH: ±4mil (0.1mm) ; NPTH: ±2mil (0.05mm)
Hole Position Deviation	± 4mil (0.1mm)
Outline Tolerance	Laser: +0.20/-0.05mm
Line Width/Spac Tolerance	± 5mil (0.125mm)	± 5mil (0.125mm)	± 1mil (0.025mm)	± 5mil (0.125mm)
Surface Treatment	AgPd, AgPt, Au	OSP/Ni Plating/ENIG/ENEPIG
Thermal Stress	1 hour @ 350℃	3 x 10 Sec @ 280 ℃	15 min @ 350 ℃	3 x 10 Sec @ 280 ℃

Item	Attribute
Brand	CeramTec / GTT / Huaqing / Laird / Maruwa / Rogers / Toshiba
Base Material	AI2O3 / AIN / BeO / SiO2
Base Material Thickness( exclude conductor)	0.20mm / 0.25mm / 0.30mm / 0.38mm / 0.50mm / 0.635mm/ 0.76mm / 0.80mm / 1.0 mm/ 1.2 mm / 1.5mm / 2.0 mm
Thermal Conductivity	24w / 27w / 170w / 200w / 240W
Soldermask Type	Glass glaze , Soldermask oil (white , black , green , blue , yellow , red )
Tg Value	200 / 250 / 300 / 400 / 500 / 600 / 700 / 800
Halogen Free	Yes(optional)
Breakdown Voltage	11 - 34 KV/
Dielectric Constant(MHZ)	9 - 10
Water Absorption	0%
ROHS	Yes
Flammability	94V-0
Thermal Conductivity (W/m.K, or W/m.C)	Al2O3: >= 24; AIN: >=170; BeO: >=240; Si304: 16 - 22
Dielectric Strength	0.635mm; 11KV/mm; 1.0mm; 17KV/mm; 2.0mm; 34KV/mm
Wrap & Twist	≤ 0.75%

Prototype(<1m²)	Layers	Normal Service	Expedited Service
Ceramic PCB	1 Layer	Thick Film:3 - 3.5weeks DCB/DBC/AMB: 3 - 4 weeks DPC: 2 - 3 weeks	Thick Film:1.5weeks DCB/DBC/AMB: 2 - 3 weeks DPC: 1.5 weeks
	2 Layers	Thick Film:3 - 4 weeks DCB/DBC/AMB: 3.5 - 4.5 weeks DPC: 2.5 - 3.5 weeks	Thick Film:2 weeks DCB/DBC/AMB: 2.5 - 3.5 weeks DPC: 2 weeks
	4 Layers	Thick Film: 4 - 6 weeks	2.5 weeks
	6 Layers	Thick Film: 4.5 - 6 weeks	2.5 weeks
	8 Layers	Thick Film: 5 -7 weeks	3 weeks
	10 Layers	Thick Film: 6 - 8 weeks	3.5 - 4 weeks

Production	Layers	Normal Service	Expedited service
Ceramic PCB	1 Layer	Thick Film:3.5 - 4 weeks DCB/DBC/AMB: 4 - 5 weeks DPC: 4 - 5 weeks	Thick Film:1.5 - 2.5 weeks DCB/DBC/AMB: 2.5 - 3.5 weeks DPC: 2 - 3 weeks
	2 Layers	Thick Film:4.5 - 5.5 weeks DCB/DBC/AMB: 5 - 6 weeks DPC: 5 - 6 weeks	Thick Film:2 - 3 weeks DCB/DBC/AMB: 3 - 4 weeks DPC: 2.5 - 3.5 weeks
	4 Layers	Thick Film: 5 -6 weeks	2.5 - 3 weeks
	6 Layers	Thick Film: 5 -6 weeks	3 - 3.5 weeks
	8 Layers	Thick Film: 6 -7 weeks	3 - 4 weeks
	10 Layers	Thick Film: 7 - 9 weeks	4 - 5 weeks